简介：封装是T/R开关的关键环节。开关封装失效主要包括外壳失效和LTCC基板失效。为了避免T/R开关失效,利用ANSYS14.0对封装进行模态仿真及加速度瞬态仿真,找出开关封装的加速度响应值以及受到应力时的频率特性,并通过随机试验和半正弦冲击试验验证仿真结果,验证封装可靠性。试验结果表明,目前的T/R开关封装可以保证组件能够承受40g以上的加速度冲击和振动。

简介：Comparedwithaccuratediagnosis,thesystem’sselfdiagnosingcapabilitycanbegreatlyincreasedthroughthet/kdiagnosisstrategyatmostkvertexestobemistakenlyidentifiedasfaultyunderthecomparisonmodel,wherekistypicallyasmallnumber.BasedonthePreparata,Metze,andChien(PMC)model,then-dimensionalhypercubenetworkisprovedtobet/kdiagnosable.Inthispaper,basedontheMaengandMalek(MM)?model,anovelt/k-faultdiagnosis(1k4)algorithmofndimensionalhypercube,calledt/k-MM?-DIAG,isproposedtoisolateallfaultyprocessorswithinthesetofnodes,amongwhichthenumberoffault-freenodesidentifiedwronglyasfaultyisatmostk.ThetimecomplexityinouralgorithmisonlyO(2nn2).